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Vertiv Launches SmartIT to Simplify High-Density AI Infrastructure Deployment

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Vertiv introduced its SmartIT high-density AI infrastructure solution on October 26, based on NVIDIA MGX and OCP ORV3 architectures and validated before shipment; it is available now worldwide.

Critical infrastructure provider Vertiv Holdings Co. (NYSE: VRT) announced on October 26 the launch of Vertiv™ SmartIT, aimed at high-density AI deployments that demand ever more power and cooling, so enterprises, research institutions and colocation providers do not have to assemble each data hall from scratch.

What the platform covers

SmartIT is a pre-engineered, factory-validated architecture based on NVIDIA MGX™ and Open Compute Project OCP ORV3 architectures. It integrates rack infrastructure, DC power conversion and distribution, direct-to-chip liquid cooling, in-rack cooling distribution and monitoring in a single design, which is then connected to a facility's power and cooling infrastructure on site. Vertiv says this reduces on-site integration complexity.

According to Vertiv, the scalable design works in existing enterprise facilities, new builds, commercial spaces, colocation and hyperscale environments without redesign, and is available now for AI deployments globally.

Prior deployment and the company's case

Vertiv says SmartIT was previously deployed with NVIDIA to support the NVIDIA DGX™ GB300 system, which Vertiv describes as the highest-performing, largest-scale AI system available for enterprises. That description is the company's own claim, not an independently verified benchmark.

Vertiv Chief Product and Technology Officer Scott Armul said AI is fundamentally changing what data centers demand in coordinated power, cooling and IT systems, and that SmartIT brings those disciplines together in one factory-validated architecture to simplify deployment, improve consistency and leave room to scale.

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