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Chery Debuts 'Ziwei' Automotive Chip Lineup With 2400 TOPS, 8-Inch Wafers in Mass Production
Chery unveiled its Ziwei chip portfolio at its 2026 Global Innovation Conference, covering central computing, silicon carbide power and vehicle control, and announced 8-inch wafer mass production.
What happened
On the morning of October 20, Chery debuted its Ziwei chip lineup at the 2026 Chery Global Innovation Conference in Wuhu, Anhui. The portfolio comprises three series: C-series central computing chips, S-series automotive silicon carbide chips, and M-series vehicle-control chips.
Why it matters
The C100 central computing chip is designed for on-device physical AI: two CPUs deliver 1000K DMIPS, a two-NPU vehicle configuration reaches 2400 TOPS, and memory bandwidth hits 600GB/s — tailored for 100-billion-parameter physical-world models. The S1500 SiC chip supports a 1500V automotive voltage rating with 1450A module current capability. Chery also announced 8-inch wafers have entered mass production, cutting costs by more than 30%, and showed five chip-packaging families covering its full vehicle platforms.
At the same conference, Chery unveiled 11 core technology clusters, including CheryMind, a foundation model built for physical AI, under its 'Yao Guang 2035' strategy to become a global smart-technology company.
Full report
TechNode reports that Ziwei marks Chery's extension of its automotive R&D and manufacturing expertise into semiconductors, expanding automaker-designed silicon from smart cockpits and driving into the full power-electronics chain. IT Home confirmed the C100 and S1500 specifications and the 8-inch wafer production milestone from the conference floor.
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