Two Chinese chip firms list in Hong Kong on the same day with split debuts: Denglin slips, Xinde jumps 20%

Suzhou Denglin Technology and Jiangsu Xinde Semiconductor both listed in Hong Kong on November 10, raising a combined HK$2.36 billion, but their first-day performances diverged sharply: AI chip designer Denglin opened 0.9% lower, while chip packaging firm Xinde opened 20.5% higher. Both priced near the bottom of their ranges, showing investors are growing selective on AI hardware stocks.
Two Chinese chip firms listed on the Hong Kong Stock Exchange on the same day, November 10, raising a combined HK$2.36 billion (about $301 million), but their first-day performances diverged sharply: AI chip designer Suzhou Denglin Technology (9917) opened at HK$229, 0.9% below its HK$231 offer price, while semiconductor packaging and testing firm Jiangsu Xinde Semiconductor Technology (7672) opened at HK$10.70, 20.5% above its HK$8.88 offer price. Both belong to the same chip-and-AI theme, yet the market's reception was hot for one and cold for the other. (Photo: file photo of the Hong Kong Stock Exchange. Photo: Storm Asia.)
Denglin: priced at the bottom of the range, still slipped
Denglin designs general-purpose graphics processing units (GPUs) for AI computing, built on its own Minsky architecture and a software stack it calls Hamming. The company priced its IPO at HK$231 a share, the very bottom of its HK$231–288 marketed range, raising HK$1.41 billion (about $180 million). Demand looked thin: the Hong Kong public offering was 2.11 times subscribed and the international tranche 1.34 times covered; the shares later traded at HK$222.40. Denglin listed under Hong Kong's Chapter 18C regime, which allows pre-commercial specialist technology companies to list; the company is still loss-making. Revenue rose 107% to $23.6 million in 2025, then reached $27.6 million in the four months to April 30, 2026, up from $797,500 a year earlier. Five cornerstone investors took 45.68% of the offer shares, and the free float is only about 5.47% of issued capital.
Xinde: retail demand pushed it 20% higher
Xinde is an outsourced assembly and test (OSAT) provider that handles packaging and testing for fabless chip clients. It priced its IPO at HK$8.88 a share, raising HK$946.3 million (about $112 million), and the shares later rose to HK$12.02. Unlike Denglin, Xinde's Hong Kong public offer was 9.84 times subscribed, while the international tranche drew 1.13 times. Xinde is also loss-making: revenue for fiscal 2025 grew 22.3% to $138.9 million, but it posted a gross loss margin of 18% and a net loss of $66.4 million, driven by depreciation and fixed costs as capacity ramps.
A test as Hong Kong's IPO market cools
The two listings were seen as a test of demand for new Hong Kong listings. According to Bloomberg data, Hong Kong IPOs have raised $51.9 billion this year, closing in on the 2010 record of $57.8 billion; but only three IPOs were completed in October, several October debuts fell below their offer prices, and some deals were postponed. Analysts read the split debut as a sign that investors are becoming selective even within the same "chips plus AI" story: Xinde, with hot retail demand and tighter early supply, was chased higher, while Denglin, with a rich price and thin demand, came under pressure.
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