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Samsung to use TSMC tech for Nvidia's next-gen AI memory chips, Seoul paper reports
The Seoul Economic Daily reports Samsung will use TSMC's 3nm process for base dies in Nvidia's next-generation NVHBM memory chips after its own foundry yields fell short; Nvidia is said to have asked Samsung, SK Hynix and Micron to follow suit.
Why it matters
If confirmed, this would be a remarkable reversal: Samsung, one of the world's largest chipmakers, outsourcing key production steps to its arch-rival TSMC at Nvidia's behest. It underlines how tight the AI memory supply chain has become — even giants must yield to whoever can deliver the yields.
Full report
Samsung Electronics will use Taiwan Semiconductor Manufacturing Co.'s 3-nanometer process to produce base dies for Nvidia's next-generation custom high-bandwidth memory chips, the Seoul Economic Daily reported Sunday.
According to the report, Samsung accepted Nvidia's supply terms and agreed to outsource the AI memory base dies to TSMC after its own foundry yields fell short of requirements. Nvidia has asked its memory suppliers — Samsung, SK Hynix and Micron — to use TSMC-produced base dies for the upcoming NVHBM hardware.
The report has not been confirmed by Samsung, TSMC or Nvidia. Production targets, delivery schedules and financial terms were not disclosed.
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