Singapore's ASMPT posts record Q3 bookings as AI packaging demand lifts revenue nearly 50%

Semiconductor equipment maker ASMPT has reported third-quarter 2026 results showing revenue of HK$5.25 billion (about US$669 million), up 48.7% year on year and 6.3% quarter on quarter, above the midpoint of its prior guidance. New bookings hit a record HK$8.85 billion (US$1.13 billion).

Headline figures

The group swung back to profit, with net profit of HK$533.22 million against a loss of HK$269.88 million a year earlier. Adjusted net profit rose 486.3% to HK$689.7 million, and adjusted operating profit jumped 379.2% to HK$922.4 million. Adjusted gross margin reached 42.9%, up 517 basis points year on year. Semiconductor Solutions revenue rose 68% to HK$2.93 billion, while Surface Mount Technology (SMT) revenue grew 29.8% to HK$2.31 billion, with SMT bookings hitting a record for a third consecutive quarter, up 122.1% year on year.

Where the AI demand is coming from

The company said AI-related demand ran across its portfolio: thermo-compression bonding (TCB) equipment saw record orders for larger compound-die tools from OSAT partners of a leading advanced logic customer, while AI server demand drove more than US$100 million in bulk SMT orders and pull-ins. Group CEO Bassel Haddad said the record bookings reflect sustained AI infrastructure investment driving demand across TCB, SMT and photonics.

Fourth-quarter outlook

ASMPT guided fourth-quarter revenue of US$670 million to US$730 million, implying 37.5% year-on-year growth at the midpoint, led by double-digit growth in SMT, while semiconductor revenue is expected to stay flat on longer lead times for advanced packaging products. The company expects AI demand to sustain growth into 2027.