Applied Materials to raise BESI stake to about 20% in AI packaging bet

US semiconductor equipment maker Applied Materials said on Monday, October 26, that it plans to raise its stake in Dutch semiconductor equipment firm BE Semiconductor Industries (BESI) to about 20% from 9%, stepping up its bet on advanced packaging technology used in artificial intelligence (AI) chips.

The deal

Applied Materials said it has entered into an accelerated share purchase agreement for the additional shares, with delivery subject to the expiry of the US antitrust review waiting period. Applied has been BESI's largest shareholder since buying an initial 9% stake in April 2025. The company said it does not plan to raise its stake beyond about 20% or seek a seat on BESI's board.

What the partnership covers

The expanded partnership will focus on new chip-connection and packaging technologies aimed at supporting next-generation AI semiconductors. The two companies have collaborated since 2020 on hybrid bonding technology, and BESI recently joined Applied's EPIC Center as an innovation partner. Prabu Raja, president of Applied's Semiconductor Products Group, said hybrid bonding and next-generation interconnect designs are becoming more critical to energy-efficient AI computing.

Context

Advanced packaging, which assembles multiple chips into high-performance AI systems, has become a key competitive front in the semiconductor industry as AI chips demand ever more performance and energy efficiency. The stake increase reflects equipment makers deepening equity ties to secure their place in the AI supply chain. Note that the purchase is an agreement signed, not yet completed; completion still depends on the regulatory waiting period.

Sources: Reuters and Dow Jones Newswires (via Morningstar), October 26, 2026; Applied Materials SEC Form 8-K press release.