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xMEMS Begins Mass Production of Solid-State Micro-Cooling Chips for Edge AI and Data Centers
Santa Clara-based xMEMS Labs announced today that its XMC-2400 and XMC-4800 µCooling chips have entered mass production — billed as the first large-scale commercialization of solid-state active cooling for AI glasses, AI smartphones and data-center hardware.
Why it matters
xMEMS Labs of Santa Clara, California announced today (October 20) that its XMC-2400 and XMC-4800 µCooling chips have entered mass production — the company's first commercial-scale deployment of its "fan-on-a-chip" technology, described by the company as the first large-scale commercialization of solid-state active cooling.
How it works
Both chips use xMEMS' all-silicon piezoMEMS technology to push air through narrow spaces around components. With no rotating blades and no bearings, they produce active airflow with no fan noise and no vibration — targeting places where conventional fans simply cannot fit, such as AI glasses.
The two products
The XMC-2400 measures just 7.42 by 9.48 by 1.13 millimeters, delivers up to 28 cubic centimeters of airflow per second at up to 1,300 pascals of back pressure while consuming about 150 milliwatts, aimed at AI and XR glasses and personal SSDs. The XMC-4800 (9.93 by 14.35 by 1.13 mm) delivers up to 48 cubic centimeters per second at up to 1,100 pascals while consuming about 240 milliwatts, aimed at AI smartphones and data-center applications including enterprise SSDs and other lower-power subsystems.
Test results and timing
According to xMEMS, customers testing µCooling have recorded chip- and system-level temperature reductions of 10 to 25 degrees Celsius across glasses, smartphones and SSDs. The first commercial products featuring XMC-2400 are expected to reach the market in early 2027; xMEMS will demonstrate µCooling applications at CES 2027 (The Venetian, Suite 34-208).
"Edge AI systems are creating thermal requirements that conventional cooling technologies cannot address," said Mike Housholder, Vice President and General Manager of xMEMS' Thermal Management Business Unit. "AI glasses and AI smartphones need active heat removal in an extremely small form factor where conventional fans simply cannot fit, while zero noise, vibration and high reliability remain critical design requirements."
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